| Batch | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | QA | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Batch 0 | 0 | 0 | 0 | 2 | 36 | 10 (6) | 0 | 0 | 9 | 2 | 59 |
| Batch 1 | 0 | 0 | 0 | 0 | 0 | 5 | 0 | 0 | 7 | 0 | 12 |
| Batch 2 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 3 | 0 | 0 | 0 | 0 | 39 | 0 | 0 | 0 | 0 | 1 | 40 |
| Batch 4 | 0 | 0 | 399 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 400 |
| Batch 5 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Total | 0 | 0 | 399 | 2 | 75 | 15 (6) | 0 | 0 | 17 | 3 | 511 |
Parenthetical counts are B-Grade boards (a subset of the stage count, not additional boards).
| Batch | Untested | In Testing | Tested and Passed | Failed | QA | Yield |
|---|---|---|---|---|---|---|
| Batch 0 | 0 | 86 | 1595 (11) | 84 | 3 | 94% (95%) |
| Batch 1 | 1 | 0 | 1227 (7) | 56 | 16 | 95% (96%) |
| Batch 2 | 0 | 69 | 1875 (38) | 47 | 9 | 96% (98%) |
| Batch 3 | 0 | 40 | 1886 (7) | 65 | 9 | 96% (97%) |
| Batch 4 | 399 | 0 | 0 | 1 | 0 | 0% (0%) |
| Batch 5 | 0 | 0 | 0 | 0 | 0 | — |
| Batch 6 | 0 | 0 | 0 | 0 | 0 | — |
| Total | 400 | 195 | 6583 (63) | 253 | 37 | 95% (96%) |
Tested and Passed shows the B-Grade count in parentheses (a subset, not additional boards). Yield = Tested and Passed / (Tested and Passed + Failed), counting B-Grade as failed; the parenthetical yield counts B-Grade as passed instead.
| Batch | Jun 2023 | Jul 2023 | Aug 2023 | Sep 2023 | Oct 2023 | Nov 2023 | Dec 2023 | Jan 2024 | Feb 2024 | Mar 2024 | Apr 2024 | May 2024 | Jun 2024 | Jul 2024 | Aug 2024 | Sep 2024 | Oct 2024 | Nov 2024 | Dec 2024 | Jan 2025 | Feb 2025 | Mar 2025 | Apr 2025 | May 2025 | Jun 2025 | Jul 2025 | Aug 2025 | Sep 2025 | Oct 2025 | Nov 2025 | Dec 2025 | Jan 2026 | Feb 2026 | Mar 2026 | Apr 2026 | May 2026 | Jun 2026 | Jul 2026 | Aug 2026 | Sep 2026 | Oct 2026 | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Batch 0 | 60 | 80 | 184 | 378 | 260 | 116 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 20 | 40 | 50 | 70 | 130 | 60 | 150 | 150 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1768 |
| Batch 1 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 300 | 450 | 550 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1300 |
| Batch 2 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 900 | 430 | 670 | 0 | 0 | 0 | 0 | 0 | 2000 |
| Batch 3 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 900 | 800 | 300 | 0 | 2000 |
| Batch 4 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 200 | 200 | 400 |
| Batch 5 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Total | 60 | 80 | 184 | 378 | 260 | 116 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 20 | 40 | 50 | 70 | 130 | 60 | 150 | 150 | 300 | 450 | 550 | 0 | 0 | 0 | 0 | 0 | 900 | 430 | 670 | 0 | 900 | 800 | 500 | 200 | 7468 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADELAIDE | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 1 |
| ANL | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 1 |
| BHM | 0 | 0 | 0 | 0 | 9 | 0 | 16 | 25 | 0 | 13 | 63 |
| BNL | 0 | 0 | 0 | 0 | 0 | 0 | 5 | 196 | 0 | 10 | 211 |
| CAM | 0 | 0 | 0 | 0 | 0 | 0 | 9 | 20 | 0 | 4 | 33 |
| CERN | 0 | 0 | 0 | 10 | 0 | 0 | 1 | 632 | 0 | 0 | 643 |
| CERN_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 3 | 0 | 0 | 3 |
| GL | 0 | 0 | 0 | 0 | 0 | 0 | 10 | 8 | 0 | 0 | 18 |
| IHEP | 0 | 0 | 0 | 0 | 0 | 0 | 4 | 20 | 0 | 0 | 24 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 7 | 34 | 0 | 10 | 51 |
| LIV | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 19 | 0 | 2 | 21 |
| RAL | 0 | 0 | 0 | 29 | 0 | 0 | 15 | 513 | 0 | 8 | 565 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 10 | 0 | 0 | 1 | 11 |
| SHF | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 7 | 0 | 3 | 10 |
| STRIPS_TB_IRRAD | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 1 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 25 | 0 | 24 | 49 |
| Total | 0 | 0 | 0 | 39 | 9 | 0 | 77 | 1505 | 0 | 75 | 1705 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADELAIDE | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 4 | 0 | 0 | 4 |
| BHM | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 5 | 0 | 0 | 5 |
| BNL | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 122 | 0 | 18 | 140 |
| CAM | 0 | 0 | 0 | 0 | 0 | 0 | 3 | 27 | 0 | 2 | 32 |
| CERN | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 491 | 0 | 1 | 493 |
| CERN_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 8 | 0 | 0 | 8 |
| GL | 0 | 0 | 0 | 0 | 0 | 0 | 2 | 16 | 0 | 2 | 20 |
| IHEP | 0 | 0 | 0 | 0 | 0 | 0 | 3 | 7 | 0 | 0 | 10 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 18 | 9 | 3 | 31 |
| LIV | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 16 | 0 | 0 | 16 |
| RAL | 0 | 0 | 1 | 0 | 0 | 0 | 4 | 439 | 0 | 4 | 448 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 9 | 0 | 0 | 1 | 10 |
| SHF | 0 | 0 | 0 | 0 | 0 | 0 | 2 | 17 | 0 | 2 | 21 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 12 | 4 | 16 | 32 |
| Total | 0 | 0 | 1 | 0 | 0 | 0 | 25 | 1182 | 13 | 49 | 1270 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BHM | 0 | 0 | 0 | 0 | 0 | 0 | 39 | 8 | 0 | 1 | 48 |
| BNL | 0 | 0 | 0 | 0 | 0 | 0 | 8 | 472 | 0 | 0 | 480 |
| CAM | 0 | 0 | 0 | 0 | 0 | 0 | 38 | 84 | 0 | 6 | 128 |
| CERN | 0 | 0 | 0 | 0 | 0 | 0 | 2 | 43 | 0 | 0 | 45 |
| GL | 0 | 0 | 0 | 0 | 0 | 0 | 99 | 52 | 0 | 3 | 154 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 146 | 0 | 13 | 179 |
| LIV | 0 | 0 | 0 | 0 | 10 | 0 | 60 | 33 | 0 | 1 | 104 |
| RAL | 0 | 0 | 0 | 0 | 30 | 0 | 23 | 454 | 0 | 2 | 509 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 20 | 0 | 87 | 0 | 0 | 3 | 110 |
| SHF | 0 | 0 | 0 | 0 | 9 | 0 | 24 | 67 | 0 | 3 | 103 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 83 | 33 | 0 | 15 | 131 |
| Total | 0 | 0 | 0 | 0 | 69 | 0 | 483 | 1392 | 0 | 47 | 1991 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BHM | 0 | 0 | 0 | 0 | 0 | 0 | 39 | 0 | 0 | 1 | 40 |
| BNL | 0 | 0 | 0 | 0 | 0 | 10 | 209 | 90 | 0 | 10 | 319 |
| CAM | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 0 | 0 | 0 | 20 |
| CERN_TRANSIT | 0 | 0 | 0 | 0 | 0 | 140 | 189 | 0 | 0 | 7 | 336 |
| GL | 0 | 0 | 0 | 0 | 0 | 0 | 27 | 0 | 0 | 2 | 29 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 229 | 255 | 0 | 15 | 499 |
| LIV | 0 | 0 | 0 | 0 | 0 | 0 | 7 | 3 | 0 | 0 | 10 |
| RAL | 0 | 0 | 0 | 0 | 0 | 0 | 14 | 43 | 0 | 3 | 60 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 308 | 0 | 0 | 11 | 319 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 192 | 115 | 0 | 13 | 320 |
| Total | 0 | 0 | 0 | 0 | 0 | 150 | 1234 | 506 | 0 | 62 | 1952 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |