| Batch | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | QA | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Batch 0 | 0 | 0 | 0 | 2 | 36 | 10 (6) | 0 | 0 | 9 | 2 | 59 |
| Batch 1 | 0 | 0 | 0 | 0 | 0 | 5 | 0 | 0 | 7 | 0 | 12 |
| Batch 2 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 3 | 0 | 0 | 291 | 0 | 263 (1) | 0 | 0 | 0 | 6 | 0 | 560 |
| Batch 4 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 5 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Total | 0 | 0 | 291 | 2 | 299 (1) | 15 (6) | 0 | 0 | 22 | 2 | 631 |
Parenthetical counts are B-Grade boards (a subset of the stage count, not additional boards).
| Batch | Untested | In Testing | Tested and Passed | Failed | QA | Yield |
|---|---|---|---|---|---|---|
| Batch 0 | 0 | 86 | 1595 (11) | 84 | 3 | 94% (95%) |
| Batch 1 | 1 | 0 | 1227 (7) | 56 | 16 | 95% (96%) |
| Batch 2 | 0 | 209 | 1736 (38) | 46 | 9 | 95% (97%) |
| Batch 3 | 291 | 263 | 901 (6) | 43 | 2 | 95% (95%) |
| Batch 4 | 0 | 0 | 0 | 0 | 0 | — |
| Batch 5 | 0 | 0 | 0 | 0 | 0 | — |
| Batch 6 | 0 | 0 | 0 | 0 | 0 | — |
| Total | 292 | 558 | 5459 (62) | 229 | 30 | 95% (96%) |
Tested and Passed shows the B-Grade count in parentheses (a subset, not additional boards). Yield = Tested and Passed / (Tested and Passed + Failed), counting B-Grade as failed; the parenthetical yield counts B-Grade as passed instead.
| Batch | Jun 2023 | Jul 2023 | Aug 2023 | Sep 2023 | Oct 2023 | Nov 2023 | Dec 2023 | Jan 2024 | Feb 2024 | Mar 2024 | Apr 2024 | May 2024 | Jun 2024 | Jul 2024 | Aug 2024 | Sep 2024 | Oct 2024 | Nov 2024 | Dec 2024 | Jan 2025 | Feb 2025 | Mar 2025 | Apr 2025 | May 2025 | Jun 2025 | Jul 2025 | Aug 2025 | Sep 2025 | Oct 2025 | Nov 2025 | Dec 2025 | Jan 2026 | Feb 2026 | Mar 2026 | Apr 2026 | May 2026 | Jun 2026 | Jul 2026 | Aug 2026 | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Batch 0 | 60 | 80 | 184 | 378 | 260 | 116 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 20 | 40 | 50 | 70 | 130 | 60 | 150 | 150 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1768 |
| Batch 1 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 300 | 450 | 550 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1300 |
| Batch 2 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 900 | 430 | 670 | 0 | 0 | 0 | 2000 |
| Batch 3 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 900 | 600 | 1500 |
| Batch 4 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 5 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Batch 6 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Total | 60 | 80 | 184 | 378 | 260 | 116 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 20 | 40 | 50 | 70 | 130 | 60 | 150 | 150 | 300 | 450 | 550 | 0 | 0 | 0 | 0 | 0 | 900 | 430 | 670 | 0 | 900 | 600 | 6568 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADELAIDE | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 1 |
| ANL | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 1 |
| BHM | 0 | 0 | 0 | 0 | 9 | 0 | 29 | 24 | 0 | 13 | 75 |
| BNL | 0 | 0 | 0 | 0 | 0 | 0 | 5 | 272 | 0 | 10 | 287 |
| CAM | 0 | 0 | 0 | 0 | 0 | 0 | 18 | 11 | 0 | 4 | 33 |
| CERN | 0 | 0 | 0 | 4 | 0 | 0 | 1 | 438 | 0 | 0 | 443 |
| CERN_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 23 | 0 | 0 | 23 |
| GL | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 8 | 0 | 0 | 8 |
| IHEP | 0 | 0 | 0 | 0 | 0 | 0 | 4 | 20 | 0 | 0 | 24 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 12 | 32 | 0 | 10 | 54 |
| LIV | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 0 | 2 | 22 |
| RAL | 0 | 0 | 0 | 35 | 0 | 0 | 15 | 582 | 0 | 8 | 640 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 0 | 0 | 1 | 21 |
| SHF | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 11 | 0 | 3 | 14 |
| STRIPS_TB_IRRAD | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 1 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 34 | 0 | 24 | 58 |
| Total | 0 | 0 | 0 | 39 | 9 | 0 | 104 | 1478 | 0 | 75 | 1705 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADELAIDE | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 4 | 0 | 0 | 4 |
| BHM | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 15 | 0 | 0 | 15 |
| BNL | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 215 | 0 | 18 | 233 |
| CAM | 0 | 0 | 0 | 0 | 0 | 0 | 3 | 29 | 0 | 2 | 34 |
| CERN | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 320 | 0 | 1 | 322 |
| CERN_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 19 | 0 | 0 | 19 |
| GL | 0 | 0 | 0 | 0 | 0 | 0 | 2 | 43 | 0 | 2 | 47 |
| IHEP | 0 | 0 | 0 | 0 | 0 | 0 | 3 | 7 | 0 | 0 | 10 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 20 | 9 | 3 | 33 |
| LIV | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 0 | 0 | 20 |
| RAL | 0 | 0 | 1 | 0 | 0 | 0 | 4 | 453 | 0 | 4 | 462 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 9 | 0 | 0 | 1 | 10 |
| SHF | 0 | 0 | 0 | 0 | 0 | 0 | 2 | 25 | 0 | 2 | 29 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 12 | 4 | 16 | 32 |
| Total | 0 | 0 | 1 | 0 | 0 | 0 | 25 | 1182 | 13 | 49 | 1270 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BHM | 0 | 0 | 0 | 0 | 0 | 0 | 50 | 2 | 0 | 0 | 52 |
| BNL | 0 | 0 | 0 | 0 | 0 | 0 | 97 | 186 | 0 | 0 | 283 |
| CAM | 0 | 0 | 0 | 0 | 50 | 0 | 49 | 68 | 0 | 6 | 173 |
| CERN_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 1 | 0 | 0 | 1 |
| GL | 0 | 0 | 0 | 0 | 0 | 0 | 74 | 44 | 0 | 2 | 120 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 53 | 235 | 0 | 13 | 301 |
| LIV | 0 | 0 | 0 | 0 | 0 | 0 | 75 | 33 | 0 | 1 | 109 |
| RAL | 0 | 0 | 0 | 0 | 90 | 0 | 10 | 307 | 0 | 2 | 409 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 165 | 0 | 0 | 4 | 169 |
| SHF | 0 | 0 | 0 | 0 | 69 | 0 | 9 | 45 | 0 | 3 | 126 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 111 | 122 | 0 | 15 | 248 |
| Total | 0 | 0 | 0 | 0 | 209 | 0 | 693 | 1043 | 0 | 46 | 1991 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| BHM | 0 | 0 | 0 | 0 | 0 | 0 | 9 | 0 | 0 | 1 | 10 |
| BNL | 0 | 0 | 0 | 0 | 0 | 0 | 48 | 0 | 0 | 2 | 50 |
| CAM | 0 | 0 | 0 | 0 | 0 | 0 | 20 | 0 | 0 | 0 | 20 |
| CERN_TRANSIT | 0 | 0 | 0 | 0 | 0 | 180 | 162 | 0 | 0 | 7 | 349 |
| LBNL_STRIP_MODULES | 0 | 0 | 0 | 0 | 0 | 0 | 124 | 85 | 0 | 10 | 219 |
| RAL_TRANSIT | 0 | 0 | 0 | 0 | 0 | 0 | 97 | 0 | 0 | 3 | 100 |
| UCSC | 0 | 0 | 0 | 0 | 0 | 0 | 84 | 98 | 0 | 8 | 190 |
| Total | 0 | 0 | 0 | 0 | 0 | 180 | 544 | 183 | 0 | 31 | 938 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |
| Location | SMD Loading | Coil and Shield Loading | Die Attachment and Bonding | Thermal Cycling | Burn-In | In Shipment | Module Reception | Loaded on a Module | Loaded on a Hybrid Burn-in Carrier | Failed Tests | Total |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Total | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 | 0 |